TE Connectivity 1775315-2 Applies To: Printed Circuit Board Assembly Process Feature: Without Pick and Place Cover Contact Plating, Mating Area, Material: Gold Contact Plating, Mating Area, Thickness (?µm [??in]): 0.762 [30] Contact Termination Type: Through Hole Gender: Receptacle Housing Color: Black Industry Standard: USB 2.0 Lead Free Solder Processes: Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder capable to 265?°C Led: Without Locating Post(s): Without Locking Feature: Without Mount Location: Top Number Of Ports: 1 Number Of Positions: 4 Orientation: Right Angle Packaging Method: Tray Panel Ground: With Panel Ground Location: Center Panel Ground Type: Ground Finger Pcb Mount Retention Type: Kinked Leg(s) Pcb Thickness, Recommended (mm [in]): 1.60 [0.063] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Series: A Shell Plating: Bright Tin Size: Standard Tail Length (mm [in]): 2.8 [0.11] Termination Method: Solder Usb-if Test Id Number (tid): Not Submitted For Testing